TTEP 2006 - Call for Tutorial Proposals

CALL FOR TUTORIAL PROPOSALS

Overview -- Submissions -- Contact -- Tutorials and Education Group (TEG)

Overview

The Tutorials & Education Group (TEG) of the IEEE Computer Society Test Technology Technical Council (TTTC) organizes in 2006 a comprehensive set of Test Technology Tutorials to be held in conjunction with TTTC sponsored technical meetings. The objective of this common call is to invite submissions for tutorial proposals in order to enable selecting the best fitted tutorials for each technical meeting, as part of the annual Test Technology Educational Program (TTEP). The tutorials accepted by the Program Committee will be included in the Test Technology Educational Program, the intent of which is to serve the test and design professionals offering fundamental education and expert knowledge in state-of-the-art test technology topics. Participation in TTEP-organized tutorials is credited by IEEE Computer Society.
Each full day tutorial corresponds to four TTEP units. Upon completion of each sixteen units official
accreditation in the form of the “IEEE TTTC Test Technology Certificate” is presented to the participants.

The TTEP 2006 tutorials program includes (but is not limited to) the following technical meetings:

Design Automation & Test in Europe Conference (DATE’06), March 6–10, Munich, Germany
Latin American Test Workshop (LATW’06), March 26–29, Buenos Aires, Argentina
VLSI Test Symposium (VTS’06), April 30–May 4, Berkeley, CA, USA
Signal Propagation on Interconnects Workshop (SPI’06), May 9–12, Potsdam, Germany
European Test Symposium (ETS’06), May 21-25, Southampton, United Kingdom
International On-Line Testing Symposium (IOLTS’06), July 10–12, Como, Italy
International Test Conference (ITC’06), October 23–27, Santa Clara, CA, USA
Asian Test Symposium (ATS’06), November 20–23, Fukuoka, Japan

TTEP accommodates a wide range of technical areas, from mature test topics of high interest to industrial test engineers to emerging test topics with emphasis on novelty. Topics of interest for year 2006 TTEP Tutorials include (but are not limited to):

Automatic test equipment
Board-level testing
Built-In Self-Test
Defect oriented testing
Design for testability
DFT testers
Diagnosis and debug
Embedded core testing
High-speed interface testing
Interconnect characterization
Memory testing
Mixed-Signal/Analog testing
Nanometer techn. testing
On-line and field testing
Performance/Delay testing
Power issues in testing
System-level testing
Test economics
Test synthesis
Test resource partitioning
Validation
Verification
Wafer testing
Yield optimization and test

Submissions

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All tutorial proposal submissions to TTEP 2006 are to be made electronically through the TTEP submissions website: http://cad.cs.unipi.gr/~ttep

Deadlines and key dates:

October 17, 2005: Deadline for DATE proposals.
December 10, 2005: Deadline for all other proposals.
November 29, 2005: Notification of acceptance for DATE.
February 28, 2006: Notification of acceptance for the other events.

Contact

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Dimitris Gizopoulos
TTEP Chair
University of Piraeus
T: +30 210 414 2372
F: +30 210 414 2264
E: dgizop@unipi.gr

Anand Raghunathan
TTEP Vice Chair
NEC USA, C&C Research Labs
T: +1 609 951 2967
F: +1 609 951 2499
E: anand@nec-labs.com

Kaushik Roy
TTEP Vice Chair
Purdue University
T: +1 765 494-2361
F: +1 765 494-3371
E: kaushik@ecn.purdue.edu

TTEP central web site: http://tab.computer.org/tttc/teg/ttep
TTEP web site for submissions: http://cad.cs.unipi.gr/~ttep

Tutorials and Education Group (TEG)

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Chair
Dimitris Gizopoulos
University of Piraeus

Vice Chair (Organization)
Anand Raghunathan
NEC Labs

Vice Chair (Program)
Kaushik Roy
Purdue University

Planning
V. Agrawal, Auburn University
G. Robinson

Communications
M. Hsiao, Virginia Tech.

Industry Relations
R. Aitken, ARM

Finance
M. Nicolaidis, iRoC Technologies

Initiatives – New Topics
B. Courtois, TIMA

Publicity
Y. Makris, Yale University
C. Metra, University of Bologna

Audio/Visual
S. Menon, Intel

Electronic Media
G. Xenoulis, U. of Piraeus

Organizing Liaisons
U. Arz, PTB
T. Aikyo, Fujitsu
V. Champac, INAOE
I. Ghosh, Fujitsu
J. Madsen, TU Denmark
J. Segura, U. Illes Balears

Program Committee (to include)
V.D. Agrawal, Auburn U.
T. Aikyo, Fujitsu
R. Aitken, ARM Physical IP
D. Appello, ST Microelectronics
U. Arz, PTB
S. Bhunia, Case West. U.
K. Butler, Texas Instruments
S. Chakravarty, Intel
V. Champac, INAOE
S. Davidson, Sun
A. Gattiker, IBM
P. Harrod, ARM
K. Hatayama, Renesas
D. Josephson, Intel
J. Madsen, Techn. U. Denmark
H. Manhaeve, Q-Star
T. McLaurin, ARM
A. Paschalis, U. of Athens
A. Raghunathan, NEC Labs
R. Raina, Freescale
G. Roberts, McGill U.
M. Slamani, IBM
B. West, Credence
D. Wheater, IBM

For more information, visit us on the web at: http://tab.computer.org/tttc/teg/ttep

The Test Technology Educational Program 2006 (TTEP 2006) is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).

TTTC's Electronic Broadcasting Service
	TTEP 2006 TEST TECHNOLOGY EDUCATIONAL PROGRAM 2006 http://tab.computer.org/tttc/teg/ttep